Heat management in semiconductor devices is increasingly critical as device structures continue to miniaturize, posing challenges to thermal management and limiting performance enhancements. This issue arises primarily from rising power density due to high integration and the difficulties of accurately measuring heat transfer at nano- and micro-scales.
The technology owner has developed nano- and micro-scale thermal measurement techniques and advanced heat dissipation materials using nanomaterials. They possess expertise across all major measurement methods, managing every aspect of the process - from selecting the appropriate technique to executing and evaluating measurements for a diverse range of targets. Notably, they have established the highest resolution and most accurate measurement technology worldwide, specifically designed for assessing nanomaterials and thin films. With this expertise, they offer consulting and contract analysis services for thermal characterization to material and device manufacturers.
In addition to measurement technology, the technology owner has developed proprietary nanomaterials and processing techniques for effective heat dissipation. This includes flexible, high-performance heat-dissipating sheets with superior thermal conductivity compared to conventional products, made from environmentally friendly materials. They also produce functional heat-dissipating materials that combine both electrical and thermal conductivity, along with electromagnetic wave shielding capabilities. By leveraging their knowledge, expertise and processing techniques, they aim to tackle thermal challenges in devices, enabling significant advancements in performance.
The technology owner is seeking collaboration with industrial partners, including semiconductor device manufacturers, material manufacturers, automobile companies, aerospace companies, and biotechnology firms.
Thermal Measurement Technology:
Heat Dissipation Material:
Thermal Measurement Technology: thermal characterization for R&D in material and device manufacturing, providing consultancy on appropriate materials, device structures, and manufacturing processes. Potential applications included:
Heat Dissipation Material: used as heat dissipation sheets and encapsulants for various applications. Potential applications included, but are not limited to:
Thermal Measurement Technology:
Heat Dissipation Material: